Name: Metal Bonded Plastic
Brand: Hangzhou Chase Technology Co., Ltd.

Metal bonded plastic has a lower density than ordinary metals and similar metallic luster and texture, which can solve the problem of flaking paint of the electroplating process. And the thermal conductivity of metal bonded plastic is much higher than ordinary plastic, which can be used in the heat dissipation shell of electronic devices.

Properties of Soft Magnetic Bonded Compounds

High resistivity and thermal conductivity and suitable for heat dissipation devices of high-frequency electronic equipment.
A simple surface polishing process can achieve metallic texture, and free-spraying technology can be realized.

Applications of Soft Magnetic Bonded Compounds

Heat dissipation shell; Substitutes of metal structure parts, crafts.

Specification of High-density Compounds and Metal Bonded Plastic

Grade			HAA	HCA	HWA
Resin Binder			PA6
Mechanical Properties	Tensile Strength	MPa	55	60	66
Mechanical Properties	Flexural Strength	MPa	100	105	112
Physical Properties	Mold Density	g/cm3	2	5.6	10
	Melt Flow Rate	g/10min	132	145	155
	HDT	℃	150	150	150
	Thermal conductivity	W/(m·K)	3.2
	Mold Shrinkage Rate	%	0.3-0.6	0.3-0.6	0.3-0.6
Injection Parameters	Pre-drying Temp	℃	80-110	80-110	80-110
	Pre-drying Time	hr	4.6	4.6	4.6
	Barrel Temp	H1 ℃	260-270	260-270	260-270
		H2 ℃	270-280	270-280	270-280
		H3 ℃	275-285	275-285	275-285
	Mold Temp	℃	80-90	80-90	80-90
	Pressure	bar	65-80	65-80	65-80
	Speed	V%	60-80	60-80	60-80